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 Surface and subsurface eddy-current imaging with GMR sensor
Tác giả hoặc Nhóm tác giả: Huu-Thang Nguyen, Jen-Tzong Jeng, Van-Dong Doan, Chinh-Hieu Dinh, Duy Vinh Dao, Thi-Trang Pham, Xuan-Thang Trinh
Nơi đăng: IEEE Transactions on Instrumentation and Measurement; Số: 70-6011310;Từ->đến trang: 1-9;Năm: 2021
Lĩnh vực: Kỹ thuật; Loại: Bài báo khoa học; Thể loại: Quốc tế
TÓM TẮT
The high sensitivity for low-frequency fields makes the tiny giant magnetoresistance (GMR) sensors suitable for high-resolution eddy-current (EC) imaging. In this work, we proposed a novel design of the miniature differential eddy-current probe with a spin-valve GMR sensor for surface and subsurface eddy-current imaging. The differential EC probe consists of a full-bridge GMR chip mounted vertically on the edge of a tiny printed-circuit board to reduce the lift-off distance. The excitation signal is perpendicular to the sensing axis of the GMR chip, which makes it sensitive to the unbalance eddy-current signal on the surface of a conductive sample. The miniature EC probe operated at frequencies from 5 to 65 kHz is sensitive to the hidden defects on a flat conductor. The spatial resolution and stability of the device are verified by taking the two-dimensional scan images over the copper film samples with hidden defects …
ABSTRACT
The high sensitivity for low-frequency fields makes the tiny giant magnetoresistance (GMR) sensors suitable for high-resolution eddy-current (EC) imaging. In this work, we proposed a novel design of the miniature differential eddy-current probe with a spin-valve GMR sensor for surface and subsurface eddy-current imaging. The differential EC probe consists of a full-bridge GMR chip mounted vertically on the edge of a tiny printed-circuit board to reduce the lift-off distance. The excitation signal is perpendicular to the sensing axis of the GMR chip, which makes it sensitive to the unbalance eddy-current signal on the surface of a conductive sample. The miniature EC probe operated at frequencies from 5 to 65 kHz is sensitive to the hidden defects on a flat conductor. The spatial resolution and stability of the device are verified by taking the two-dimensional scan images over the copper film samples with hidden defects …
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